The MCW60-R2™ VGA waterblock is a next generation liquid cooling solution for high-end graphics processors. It evolves from the award winning MCW60-R by receiving the same base plate technology as the Swiftech Stealth water-block: a 40% smaller Diamond Pin Matrix which improves thermal resistance from 0.01 to 0.02.

In its black and chrome trim, the MCW60-R2 VGA cooler is a perfect match to complement either the APOGEE GTX or D-Tek FuZion v.2 CPU

Features

• The thermal performance model focuses extreme cooling where it is in fact the most needed: at the GPU level. This will afford better overclocks, and overall lower system temperature. Efficient and silent memory cooling is handled by using individual Ramsinks.
• The MCW60-R2 waterblock inherits all its thermal and hydraulic characteristics from the Swiftech Stealth GPU water-block, proven for its thermal efficiency with today's high end CPUs.
• Water-block ships with 1/2" and 3/8" barbs in the US, and an extra pair of 1/4" fittings for Europe, guaranteeing compatibility with any liquid cooling circuit.
• Low water-block profile allows installation with nVidia's SLI and ATI's CrossFire™ systems.
• The NPSM thread used in the MCW60-R2 is BSPP and G 1/4 fittings compatible.
• The housing is injection molded from POM (Acetal Co-polymer) resulting in complete reliability compared to machined Acrylic tops which tend to crack.
• All hydraulic joints (housing to cold-plate and fittings) use o-rings for complete reliability and leak-free operations.
• The mounting system includes a strong stiffening back-plate with a soft rubber center pad to prevent the circuit-board from bending .
• Cost of ownership is reduced by up to 50% compared to monolithic solutions, with superior performance where it really counts, and complete freedom in terms of graphics cards upgradability.

Compatibility:

Current Compatibilty Chart (new window)

Specification

Model name: MCW60-R2
Housing:
- Injection molded POM (Acetal Copolymer)
Base Plate:
- Submersed face is CNC machined from billet to form our award winning Diamond-Pin Matrix. The design increases heat dissipation surface, and flow turbulence to enhance heat transfer to the cooling fluid.
- The pin area is bead-blasted to guarantee a finish free of shavings
- Exceptional quality and attention to details: The base is lapped to 0.0003" (3/10 of 1/1000"), and polished to near-mirror finish to promote optimum thermal conductivity. Users are advised that while flatness is strictly respected for providing the most significant benefit to thermal interface, surface polish is a cosmetic component and may vary slightly from one heatsink to another. Re-lapping or polishing the copper base is never recommended. The center section is raised to provide clearance for stiffening frames.
Dimensions: Overall dimensions (.pdf)

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