IC Diamond Thermal Performance

IC Diamond out performs all other compounds in independent user testing among the popular brands tested, IC Diamond Contains 92% pure synthetic diamond. Purified synthetic diamond has a thermal conductivity of 2,000- 2,500 W/mk compared to 406-429 W/mK for pure silver Diamond is a well known Insulator , IC Diamond is electrically non-conductive and non-capacitive providing protection for electrical components where used.

IC Diamond 7 or 24 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity.

Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.

Key Features

• Each tube of IC Diamond Thermal grease contains 7 or 24 carats of micronized diamond with diamond particle loadings @ 94% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
• Superior bulk conductivity
• Excellent thermal impedance
• Tight particle distributions
• < 40 µ maximum particle diameter
• Silicone free
• Lower viscosity
• Greater stability

• Non capacitive or electrically conductive

   

Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use *

Stability: IC Diamond is designed for stability - it will not bleed or separate in normal use.

Key Specifications

Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 µ BLT
Average Particle Size: <40 µ maximum particle diameter
Compliancy: RoHS Compliant.

Note* Cure Time Assumes an optimized pressure of 50  PSI. Lighter load pressures will increase cure times to a week or more.

http://www.innovationcooling.com/Multiforumtestresult.htm

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